Koch Chemie Polishing Pads

Description

Koch Chemie Polishing Pads

High-quality special sponge for removing scratches, swirl marks and Finsihing. A very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during polishing. The optimised reticulation (open cellular structure) and cell count contribute to a high-shine finish and very good hygiene factors. The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier. The colourful non-woven material, suitable for polishing, ensures process safety.